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This section includes 521 Mcqs, each offering curated multiple-choice questions to sharpen your Physical Electronics Devices and ICs knowledge and support exam preparation. Choose a topic below to get started.
| 301. |
Consider the JFET circuit given below |
| A. | 2 26 mA |
| B. | 3 39 mA |
| C. | 1 48 mA |
| D. | 2 78 mA |
| Answer» B. 3 39 mA | |
| 302. |
Moor s law is related to |
| A. | Speed of operation of bipolar device |
| B. | Speed of operation of MOS devices |
| C. | Power rating of MOS devices |
| D. | Level of integration of MOS devices |
| Answer» E. | |
| 303. |
Match List-I (State of operation of an N-MOSFET) with List-II (Required condition) and select the correct answer using the code given below the lists |
| A. | 2314 |
| B. | 4132 |
| C. | 2134 |
| D. | 4312 |
| Answer» C. 2134 | |
| 304. |
A common source FET amplifier has C |
| A. | 47 |
| B. | 35 K |
| C. | 27 K |
| D. | 10 K |
| Answer» D. 10 K | |
| 305. |
For the FET source follower circuit shown below, R |
| A. | 30 K, 390 ohms |
| B. | 151 K, 1 K |
| C. | 167 K, 500 ohms |
| D. | 200 K, 1 K |
| Answer» D. 200 K, 1 K | |
| 306. |
The JFET in a circuit shown in figure has an I |
| A. | 150 |
| B. | 470 |
| C. | 560 |
| D. | 1 k |
| Answer» B. 470 | |
| 307. |
For the series connected JFETs, I |
| A. | 1 22 V |
| B. | 2 44 V |
| C. | 0 V |
| D. | + 2 44 V |
| Answer» D. + 2 44 V | |
| 308. |
Metal used in the metallization of CMOS circuits is |
| A. | Gold |
| B. | Silver |
| C. | Iron |
| D. | Aluminium |
| Answer» E. | |
| 309. |
Photoetching is a process of |
| A. | Selective removal of a layer |
| B. | Diffusion of impurities |
| C. | Removal of photoresist |
| D. | Making dicing marks |
| Answer» B. Diffusion of impurities | |
| 310. |
In monolithic IC fabrication process |
| A. | (i) only |
| B. | (ii) and (iv) only |
| C. | (i), (iii) and (iv) only |
| D. | (i) and (iv) only |
| Answer» E. | |
| 311. |
If a small amount of antimony is added to germanium |
| A. | The resistance is increased. |
| B. | The germanium will be a p-type semiconductor. |
| C. | The antimony becomes an acceptor impurity. |
| D. | There will be more free electrons than holes in the semiconductor. |
| Answer» E. | |
| 312. |
The movement of a hole is brought about by |
| A. | The vacancy being filled by a free electron. |
| B. | The vacancy being filled by a valence electron from a neighbouring atom. |
| C. | The movement of an atomic core. |
| D. | The atomic core changing from a + 4 to a + 5 charge. |
| Answer» C. The movement of an atomic core. | |
| 313. |
When the temperature of an intrinsic semiconductor is increased |
| A. | Resistance of the semiconductor increases. |
| B. | Heat energy decreases the atomic radius. |
| C. | Holes are created in the conduction band. |
| D. | Energy of the atoms is increased. |
| Answer» E. | |
| 314. |
When a voltage is applied to an intrinsic semiconductor which is at room temperature |
| A. | Electrons move to the positive terminal and holes move to the negative terminal. |
| B. | Holes move to the positive terminal and electrons move to the negative terminal. |
| C. | Both holes and electrons move to the positive terminal. |
| D. | Both holes and electrons move to the negative terminal. |
| Answer» B. Holes move to the positive terminal and electrons move to the negative terminal. | |
| 315. |
Sheet resistance for 1-mil thick silicon wafer with phosphorous doping of 10 |
| A. | 300 /square |
| B. | 200 /square |
| C. | 350 /square |
| D. | 240 /square |
| Answer» C. 350 /square | |
| 316. |
In an n-type semiconductor, the concentration of minority carriers mainly depends upon |
| A. | The doping technique. |
| B. | The number of donor atoms. |
| C. | The temperature of the material. |
| D. | The quality of the intrinisic material, Ge or Si. |
| Answer» D. The quality of the intrinisic material, Ge or Si. | |
| 317. |
The conduction band |
| A. | Is always located at the top of the crystal. |
| B. | Is also called the forbidden energy gap. |
| C. | Is a range of energies corresponding to the free electrons. |
| D. | Is not an allowed energy band. |
| Answer» D. Is not an allowed energy band. | |
| 318. |
Donor type impurities |
| A. | Create excess holes. |
| B. | Can be added to germanium, but not to silicon. |
| C. | Must have only three valence electrons. |
| D. | Must have only five valence electrons. |
| Answer» E. | |
| 319. |
The minimum number of isolation regions required for the circuit shown are |
| A. | 2 |
| B. | 3 |
| C. | 4 |
| D. | 7 |
| Answer» B. 3 | |
| 320. |
Threshold voltage of MOSFET can be lowered by: |
| A. | (iii) only |
| B. | (i) and (iii) only |
| C. | (i) and (ii) only |
| D. | (ii) only |
| Answer» B. (i) and (iii) only | |
| 321. |
Consider the following steps |
| A. | 2, 4, 3, 1 |
| B. | 4, 2, 3, 1 |
| C. | 1, 4, 2, 3 |
| D. | 1, 2, 3, 4 |
| Answer» D. 1, 2, 3, 4 | |
| 322. |
High threshold MOSFET can be obtained by using silicon crystal orientation |
| A. | <100> |
| B. | <101> |
| C. | <110> |
| D. | <111> |
| Answer» D. <111> | |
| 323. |
In MOSFET devices the n-channel type is better than the p-channel type in the following respects |
| A. | It has better noise immunity |
| B. | It is faster |
| C. | It is TTL compatible |
| D. | It has better drive capability |
| Answer» C. It is TTL compatible | |
| 324. |
A Field-Effect Transistor (FET) |
| A. | Uses a high-concentration emitter junction |
| B. | Uses a forward-biased pn-junction |
| C. | Has a very high input resistance |
| D. | Depends on minority-carrier flow |
| Answer» D. Depends on minority-carrier flow | |
| 325. |
The operation of a JEFT involves |
| A. | A flow of minority carriers |
| B. | A flow of majority carriers |
| C. | Recombination |
| D. | Negative resistance |
| Answer» C. Recombination | |
| 326. |
An n-channel JFET having a pinch-off voltage V |
| A. | 1 5 |
| B. | 2 0 |
| C. | 2 5 |
| D. | 3 0 |
| Answer» D. 3 0 | |
| 327. |
For a MOS capacitor fabricated on a p-type semiconductor, strong inversion occur when |
| A. | Surface potential equals to fermi potential |
| B. | Surface potential is zero |
| C. | Surface potential is negative and equal to fermi potential in magnitude |
| D. | Surface potential is positive and equal to twice the fermi potential |
| Answer» D. Surface potential is positive and equal to twice the fermi potential | |
| 328. |
Secondary breakdown occurs in |
| A. | MOSFET but not in BJT |
| B. | Both MOSFET and BJT |
| C. | BJT but not in MOSFET |
| D. | None of these |
| Answer» D. None of these | |
| 329. |
The measured transconductance gm of an NMOS transistor operating in the linear region is plotted against the gate voltage V |
| A. | <img src="http://images.interviewmania.com/wp-content/uploads/2019/04/31oA.png"> |
| B. | <img src="http://images.interviewmania.com/wp-content/uploads/2019/04/31oB.png%20"> |
| C. | <img src="http://images.interviewmania.com/wp-content/uploads/2019/04/31oC.png%20"> |
| D. | <img src="http://images.interviewmania.com/wp-content/uploads/2019/04/31oD.png"> |
| Answer» B. <img src="http://images.interviewmania.com/wp-content/uploads/2019/04/31oB.png%20"> | |
| 330. |
Compared to the junction transistor, FET |
| A. | 1 and 3 |
| B. | 1 and 2 |
| C. | 2 and 4 |
| D. | 3 and 4 |
| Answer» D. 3 and 4 | |
| 331. |
In amplifier applications FET is operated in the |
| A. | Controlled resistor region |
| B. | Controlled source region |
| C. | Avalanche breakdown region |
| D. | None of these |
| Answer» B. Controlled source region | |
| 332. |
Lower chip area requirement of MOS is of advantage in |
| A. | Low power circuits |
| B. | High power circuits |
| C. | Repetative operation circuits |
| D. | Large scale integration |
| Answer» E. | |
| 333. |
Two perfectly matched silicon transistors are connected as shown in figure below. Assuming the of the transistor to be very high and forward voltage drop in diodes to be 0 7 V, the value of current I is |
| A. | 0 mA |
| B. | 3 6 mA |
| C. | 4 3 mA |
| D. | 5 7 mA |
| Answer» C. 4 3 mA | |
| 334. |
The common emitter forward current gain of the transistor shown below is |
| A. | Saturation region |
| B. | Cut-off region |
| C. | Reverse active region |
| D. | Forward active region |
| Answer» D. Forward active region | |
| 335. |
In a transistor h |
| A. | 2 M |
| B. | 500 K |
| C. | 2 5 M |
| D. | 780 K |
| Answer» C. 2 5 M | |
| 336. |
The circuit given below employs a silicon transistor with the = 50. The value of biasing resistance R |
| A. | 120 K |
| B. | 78 K |
| C. | 193 K |
| D. | 122 K |
| Answer» D. 122 K | |
| 337. |
If an amplifier with gain of 1000 and feedback of = 0 1 had a gain change of 20% due to temperature, the change in gain of the feedback amplifier would be |
| A. | 10% |
| B. | 5% |
| C. | 0 2% |
| D. | 0 01% |
| Answer» D. 0 01% | |
| 338. |
If = 0 995, I |
| A. | 25 A |
| B. | 100 A |
| C. | 10 1 A |
| D. | 10 5 A |
| Answer» C. 10 1 A | |
| 339. |
For a PNP transistor, = |
| A. | 15 2 A |
| B. | 52 6 A |
| C. | 72 5 A |
| D. | 1 00 A |
| Answer» E. | |
| 340. |
If = 0 98, I |
| A. | 2 3 mA |
| B. | 3 1 mA |
| C. | 4 6 mA |
| D. | 5 2 mA |
| Answer» E. | |
| 341. |
For the 2N 338 transistor, the manufacturing specifies P |
| A. | 10 C/W |
| B. | 100 C/W |
| C. | 1000 C/W |
| D. | 10,000 C/W |
| Answer» D. 10,000 C/W | |
| 342. |
If the differential and common mode gains of a differential amplifier are 50 to 0 2 respectively, then the CMRR will be |
| A. | 100 dB |
| B. | 49 8 dB |
| C. | 8 7 dB |
| D. | 10 7 dB |
| Answer» E. | |
| 343. |
A BJT having = 100 is biased at a dc collector current of 1 mA. The values of gm, re and r at the bias point are given respectively by |
| A. | 20 mA/V, 50 , 2 5 k |
| B. | 40 mA/V, 25 , 2 5 k |
| C. | 10 mA/V, 100 , 2 5 k |
| D. | None of the above |
| Answer» C. 10 mA/V, 100 , 2 5 k | |
| 344. |
A Si transistor has a thermal ratings, T |
| A. | 143 W |
| B. | 59 W |
| C. | 110 W |
| D. | 85 W |
| Answer» B. 59 W | |
| 345. |
Consider the circuit shown in figure below. If the of the transistor is 30 and I |
| A. | Saturation region |
| B. | Active region |
| C. | Breakdown region |
| D. | Cut-off region |
| Answer» C. Breakdown region | |
| 346. |
An emitter in a bipolar junction transistor is doped much more heavily than the base as it increases the |
| A. | Emitter efficiency |
| B. | Base transport factor |
| C. | Forward current gain |
| D. | All the three given above |
| Answer» D. All the three given above | |
| 347. |
A common collector amplifier uses a transistor whose h-paramters are h |
| A. | 0 53 |
| B. | 0 93 |
| C. | 1 2 |
| D. | 2 3 |
| Answer» B. 0 93 | |
| 348. |
In the circuit shown below V |
| A. | 200 m mho |
| B. | 400 m mho |
| C. | 200 ohms |
| D. | 400 ohms |
| Answer» C. 200 ohms | |
| 349. |
The two transistors in figure are identical. If = 25, the current I |
| A. | 28 A |
| B. | 23 2 A |
| C. | 26 A |
| D. | 24 A |
| Answer» C. 26 A | |
| 350. |
Match List-I (Devices) with List-II (Characteristic) and select the correct answer using the code given below the lists: |
| A. | 1423 |
| B. | 2413 |
| C. | 2314 |
| D. | 1324 |
| Answer» D. 1324 | |