MCQOPTIONS
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This section includes 15 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
For replication of micro parts moulding is preferred |
| A. | True |
| B. | False |
| Answer» B. False | |
| 2. |
In magnetic flow polishing process, very small force is applied by the abrasives. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 3. |
MRAFF is the hybrid finishing process of MRF and AFF. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 4. |
Ferromagnetic particles are attracted towards the area of a higher magnetic field. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 5. |
Magnetic Float Polishing is a technique based on_____ |
| A. | magneto-dynamic behaviour |
| B. | magneto-hydrodynamic behaviour |
| C. | kinematic behaviour |
| D. | viscosity |
| Answer» C. kinematic behaviour | |
| 6. |
MAF was developed to produce efficiently and economically good quality finish material. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 7. |
CMP is used for flat surfaces only. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 8. |
In chemo-mechanical polishing (CMP) process, material is removed due to abrading. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 9. |
Abrasive flow machining (AFM) is used for _____ |
| A. | de-burring |
| B. | etching |
| C. | drilling |
| D. | cutting |
| Answer» B. etching | |
| 10. |
MRF is used for finishing of brittle materials. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 11. |
Magneto rheological abrasive finishing (MRF) is a magnetic field assisted process. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 12. |
It is required to remove material in the form of atoms for finishing of the surface. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 13. |
Chemical micromachining is used for engraving the metal. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 14. |
Thermal micromachining processes can be used to produce reduced hole diameter, lower hole pitch. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 15. |
There is no thermal damage to the workpiece in IBM. |
| A. | True |
| B. | False |
| Answer» B. False | |