MCQOPTIONS
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MCQOPTIONS
This section includes 13 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
In case of over-etching, material under protective layer gets removed. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 2. |
Product after etching of Si wafer with KOH is ______________ shape. |
| A. | square |
| B. | circular at the end |
| C. | trapezoidal |
| D. | oval |
| Answer» D. oval | |
| 3. |
Incomplete etch occurs due to ___________ |
| A. | high concentration of the chemicals |
| B. | high pressure |
| C. | insufficient temperature |
| D. | low chemical activity |
| Answer» D. low chemical activity | |
| 4. |
IN_CASE_OF_OVER-ETCHING,_MATERIAL_UNDER_PROTECTIVE_LAYER_GETS_REMOVED.?$ |
| A. | True |
| B. | False |
| Answer» B. False | |
| 5. |
Product after etching of Si wafer with KOH is ______________ shape? |
| A. | square |
| B. | circular at the end |
| C. | trapezoidal |
| D. | oval |
| Answer» D. oval | |
| 6. |
Incomplete etch occurs due to __________? |
| A. | high concentration of the chemicals |
| B. | high pressure |
| C. | insufficient temperature |
| D. | low chemical activity |
| Answer» D. low chemical activity | |
| 7. |
The wet etching process is ___________ |
| A. | isotropic |
| B. | anisotropic |
| C. | isotropic for few materials |
| D. | isobaric process |
| Answer» C. isotropic for few materials | |
| 8. |
Wet etching is used for removal of material from large areas. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 9. |
The time for etching is independent of material to be removed. |
| A. | True |
| B. | False |
| Answer» C. | |
| 10. |
________________ is used to protect the remaining area of the wafer while machining. |
| A. | Tin foil |
| B. | Wood |
| C. | Photoresist layer |
| D. | Sodium bicarbonate |
| Answer» D. Sodium bicarbonate | |
| 11. |
In wet etching material is removed by ___________ |
| A. | absorption |
| B. | sublimation |
| C. | chemical reaction |
| D. | the force exerted due to flow of solvent |
| Answer» D. the force exerted due to flow of solvent | |
| 12. |
Deposition is a complimentary process to etching. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 13. |
Etching refers to the removal of material from ___________ |
| A. | the soft surface |
| B. | the hard surface |
| C. | the sticky surface |
| D. | the wafer surface |
| Answer» E. | |