In the slice processing of an integrated circuit

1.	In the slice processing of an integrated circuit
A.	components are formed in the areas where silicon dioxide remains
B.	components are formed in the areas where silicon dioxide has been removed
C.	the diffusing elements diffuse through silicon dioxide
D.	only on diffusion process is used
Answer» C. the diffusing elements diffuse through silicon dioxide

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In the slice processing of an integrated circuit

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