MCQOPTIONS
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| 1. |
A silicon wafer has 100 nm of oxide it and is inserted in a furnace at a temperature above 1000°C for further oxidation in dry oxygen. The oxidation rate |
| A. | is independent of current oxide thickness and temperature |
| B. | is independent of current oxide thickness but depends on temperature |
| C. | slows down as the oxide grows |
| D. | is zero as the existing oxide prevents further oxidation |
| Answer» E. | |